MediaTek, a leading fabless semiconductor company, has announced its first Dimensity chipset using TSMC’s 3nm process. The new chipset, which is codenamed Dimensity 9000+, is expected to offer significant performance and power efficiency improvements over its predecessor.
The Dimensity 9000+ is built on TSMC’s N3 process, which is the company’s most advanced semiconductor manufacturing process to date. The process uses extreme ultraviolet (EUV) lithography to create transistors that are smaller and more efficient than those made with traditional lithography techniques.
As a result of the smaller transistors, the Dimensity 9000+ is expected to offer a 18% performance boost and a 32% power efficiency improvement over the Dimensity 9000. The chipset also features a new Armv9 CPU architecture, which is designed to deliver better performance and efficiency for a wide range of applications.
In addition to the performance and power efficiency improvements, the Dimensity 9000+ also features a number of other enhancements, including:
- A new AI engine that is said to be 30% more powerful than the AI engine in the Dimensity 9000
- A new ISP that can support up to 200MP cameras
- A new 5G modem that supports faster speeds and lower latency
MediaTek has not yet announced when the Dimensity 9000+ will be available, but it is expected to be launched in 2024. The chipset is expected to be used in a wide range of high-end smartphones, tablets, and other devices.
The announcement of the Dimensity 9000+ is a significant development in the semiconductor industry. It is the first 3nm chipset to be announced, and it is expected to set a new standard for performance and power efficiency. The Dimensity 9000+ is also a major coup for MediaTek, as it shows that the company is capable of competing with the likes of Qualcomm and Samsung in the high-end smartphone market.
The Dimensity 9000+ is a significant step forward for MediaTek, and it is sure to have a major impact on the mobile industry. The chipset is expected to power some of the most advanced smartphones and other devices in 2024, and it will help to keep MediaTek at the forefront of the semiconductor industry.
In addition to the Dimensity 9000+, MediaTek also announced a number of other new chipsets at the event. These include the Dimensity 1050, a 6nm chipset for mid-range smartphones; the Dimensity 8100, a 5nm chipset for premium mid-range smartphones; and the Dimensity 7000, a 5nm chipset for entry-level smartphones.
The new chipsets from MediaTek are a sign of the company’s continued commitment to innovation. MediaTek is one of the leading semiconductor companies in the world, and its new chipsets are sure to play a major role in the mobile industry in the years to come.
Impact of the Dimensity 9000+
The Dimensity 9000+ is expected to have a significant impact on the mobile industry. The chipset’s performance and power efficiency improvements will make it a popular choice for high-end smartphones and other devices. The Dimensity 9000+ is also expected to help MediaTek compete with the likes of Qualcomm and Samsung in the high-end smartphone market.
In addition to the Dimensity 9000+, MediaTek also announced a number of other new chipsets at the event. These chipsets are also expected to have a major impact on the mobile industry. The Dimensity 1050, Dimensity 8100, and Dimensity 7000 are all powerful and efficient chipsets that are sure to be popular choices for mid-range and entry-level smartphones.
The launch of the Dimensity 9000+ and other new chipsets from MediaTek is a sign of the company’s continued commitment to innovation. MediaTek is one of the leading semiconductor companies in the world, and its new chipsets are sure to play a major role in the mobile industry in the years to come.
MediaTek Dimensity 9000+: Key Features
The Dimensity 9000+ is a powerful chipset that is designed to deliver the best possible performance and experience for a wide range of applications. Some of its key features include:
- A 4nm process from TSMC
- A new Armv9 CPU architecture with 14 cores (4x Cortex-X2, 2x Cortex-A710, and 4x Cortex-A510)
- A new Mali-G710 MC10 GPU
- A new MediaTek 9000 NPU
- A new 5G modem with support for sub-6GHz and mmWave bands
- Support for up to 200MP cameras
- Support for up to 16GB of LPDDR5 RAM
- Support for up to 2TB of UFS 3.1 storage
Performance and Power Efficiency
The Dimensity 9000+ is expected to offer significant performance and power efficiency improvements over its predecessor. The new Armv9 CPU architecture is designed to deliver better performance and efficiency for a wide range of applications. The Dimensity 9000+ is also built on TSMC’s 4nm process, which is the company’s most advanced semiconductor manufacturing process to date. This process uses extreme ultraviolet (EUV) lithography to create transistors that are smaller and more efficient than those made with traditional lithography techniques.
AI and Imaging
The Dimensity 9000+ also features a new MediaTek 9000 NPU, which is said to be 30% more powerful than the NPU in the Dimensity 9000. This will allow the Dimensity 9000+ to handle more demanding AI tasks, such as real-time object detection and segmentation. The Dimensity 9000+ also supports up to 200MP cameras, which will allow it to capture high-quality images and videos.
5G and Connectivity
The Dimensity 9000+ features a new 5G modem with support for sub-6GHz and mmWave bands. This will allow the Dimensity 9000+ to connect to the fastest 5G networks available. The Dimensity 9000+ also supports Wi-Fi 6E, which is the latest version of Wi-Fi. This will allow the Dimensity 9000+ to connect to Wi-Fi networks at speeds of up to 6GHz.